Thin Film - CdTe and CIGS

 

Thin film metrology challenges include inspection of P1, P2 and P3 scribes for width, pitch, offset between scribes, defects within scribes and defects in the active zones, between the scribe sets.  While other metrology systems provide only limited statistical scribe imaging (less than 1% of the active area), Dark Field Technologies delivers systems which deliver 100% scribe inspection, pitch and offset, on-line, real-time while concurrently detecting coating defects between the scribe regimes. AND, NxtGen™ systems deliver this extraordinary metrology independent of the orientation of the scribes (parallel or perpendicular to the conveyor direction).