Thin Film - CdTe and CIGS

 

Thin film metrology challenges include inspection of P1, P2 and P3 scribes for width, pitch, offset between scribes, defects within scribes, defects in the active zones, and between the scribe sets.  While other metrology systems provide only limited statistical scribe imaging (less than 1% of the active area), Dark Field Technologies delivers 100% scribe inspection, including pitch and offset ON-LINE in REAL-TIME, while concurrently detecting coating defects between the scribe regimes. AND, NxtGen systems deliver this extraordinary metrology independent of the orientation of the scribes (parallel or perpendicular to the conveyor direction).